去助焊剂站点设备解析与故障分析

去助焊剂站点设备解析与故障分析

摘要：助焊剂及残余会减弱环氧树脂和基片或芯片之间的粘连，因此芯片在涂环氧树脂之前必须是清洁的。去除残留在基片上的助焊剂是Intel成都封装测试工厂整个封装测试工艺中的一个小工艺，属于封装类.完成此功能的设备有卸载器，传送器，CBW224清洗机，装载器. 完成清洗的设备是CBW224,它包括六个区域：冲洗区，预漂洗区，漂洗区，最终漂洗区，吹风区，烘干区。各个区域实现一个必不可少的功能。它是通过用一定温度的去离子水对基片表面的冲洗来去除助焊剂，再经过吹风和烘干来干燥基片达到最终的净化。在这个过程中它要求要去离子水的温度，压力，PH值，电阻率，网带的速度，吹风区吹风的压力，烘干区的温度都只能在一个很小的范围内有一个很小的变化。对一个精密的CPU而言，一个很小的外界环境变化都可能对它的性能导致致命的损伤。所以实时准确的控制各项参数最为重要。所以深入了解各个设备的各个部件构造和工作原理是最为关键的。

关键词: 去助焊剂，CBW224，去离子水，冲洗区，预漂洗区，漂洗区，最终漂洗区，吹风区，烘干区，环氧树脂，温度，压力，PH值，电阻率。

Abstract: Flux and reduces the residual resin and substrate or adhesion between the chips, so chip in the epoxy coating must be clean before. Residue in the substrate to remove the flux is the Intel assembly and test factory in Chengdu whole process of packaging and testing of a small craft, belonging to category package. The completion of this function to uninstall the equipment, and transmitter, CBW224 washing machine, Loader .Complete cleaning of equipment is CBW224, which includes six areas: wash area, pre-rinse area, rinse area, the final rinse zone, briefing areas, drying areas. All regions to achieve an essential function. It is through the use of a certain temperature deionized water to rinse the surface of the substrate to remove the flux, and then through to the dry hair and drying the substrate to achieve the final purification.In the process it requires to go ion the water temperature, pressure, PH value, the resistivity, the net with the speed, the pressure of hair-hair zone, drying zone temperature are only a very small scope there is a very small changes. CPU of a sophisticated, a very small change in the external environment may result in the performance of its fatal injury. Therefore, accurate real-time control of the parameters of the most important. Therefore, better understanding of the various equipment in various parts of the structure and working principle is the most crucial.

Key words : Deflux, CBW224, deionized water, wash area, pre-rinse area, rinse area, the

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