MT7621_Datasheet_v0_3(3)

Table of Contents

OVERVIEW ....................................................................................................................................................... 2 FEATURES ........................................................................................................................................................ 2 FUNCTIONAL BLOCK DIAGRAM ........................................................................................................................ 2 TABLE OF CONTENTS ........................................................................................................................................ 3 1. MAIN FEATURES .......................................................................................................................................... 5 1.1 SWITCH CORE .................................................................................................................................................... 5

1.1.1 Overview ................................................................................................................................................ 5 1.1.2 Features ................................................................................................................................................. 6 2. PINS ............................................................................................................................................................. 7 2.1 BALL MAP (TOP VIEW) ....................................................................................................................................... 7 2.2 PIN DESCRIPTIONS ............................................................................................................................................. 8 2.3 PIN SHARING SCHEMES ..................................................................................................................................... 15 2.3.1 GPIO pin share scheme ........................................................................................................................ 15 2.3.2 UART pin share scheme ....................................................................................................................... 16 2.3.3 RGMII pin share schemes ..................................................................................................................... 17 2.3.4 WDT_RST_MODE pin share scheme .................................................................................................... 17 2.3.5 PERST_N pin share scheme .................................................................................................................. 17 2.3.6 MDC/MDIO pin share scheme: ............................................................................................................ 17 2.3.7 NAND/SDXC/SPI pin share scheme ...................................................................................................... 18 2.3.8 xMII PHY/MAC Pin Mapping ................................................................................................................ 20 2.4 STRAPPING OPTIONS ........................................................................................................................................ 21 3. ELECTRICAL CHARACTERISTICS ................................................................................................................... 22 3.1 ABSOLUTE MAXIMUM RATINGS .......................................................................................................................... 22 3.2 RECOMMENDED OPERATING RANGE ................................................................................................................... 22 3.3 DC CHARACTERISTICS ....................................................................................................................................... 22 3.4 THERMAL CHARACTERISTICS ............................................................................................................................... 23 3.5 CURRENT CONSUMPTION .................................................................................................................................. 23 3.6 STORAGE CONDITIONS ...................................................................................................................................... 24 3.7 EXTERNAL XTAL SPECFICATION ........................................................................................................................... 24 3.8 AC ELECTRICAL CHARACTERISTICS ....................................................................................................................... 25 3.8.1 DDR SDRAM Interface .......................................................................................................................... 25 3.8.2 RGMII Interface .................................................................................................................................... 27 3.8.3 MII Interface (25 Mhz) ......................................................................................................................... 28 3.8.4 RvMII Interface (PHY Mode MII Timing) (25 Mhz) ............................................................................... 29 3.8.5 SPI Interface ......................................................................................................................................... 30

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3.8.6 IS Interface .......................................................................................................................................... 31 3.8.7 PCM Interface ...................................................................................................................................... 32 3.8.8 I2C Interface ......................................................................................................................................... 32 3.8.9 SDIO Interface ...................................................................................................................................... 33 3.8.10 NAND Flash Interface (Samsung Compatibel Device) ........................................................................ 34 3.8.11 Power On Sequence ........................................................................................................................... 37 4. PACKAGE INFORMATION ........................................................................................................................... 38 4.1 DIMENSIONS - TFBGA (11.7 MM X 13.6 MM) ..................................................................................................... 38

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