芯片采购IC采购必看 - 图文(2)

DIP Dual Inline Package SSOP 16L DIP-tab Dual Inline Package with Metal Heatsink SSOP FBGA TO18 FDIP TO220 FTO220 TO247 Flat Pack TO264 HSOP28 TO3 ITO220 ITO3p TO5 JLCC TO52 LCC TO71 LDCC TO72 LGA TO78 LQFP TO8 PCDIP PGA Plastic Pin Grid Array TO92 TO93 PLCC TO99 PQFP PSDIP TSOP Thin Small Outline Package LQFP 100L TSSOP or TSOP II Thin Shrink Outline Package METAL QUAD 100L uBGA Micro Ball Grid APQFP 100L rray uBGA Micro Ball Grid Array QFP Quad Flat Package SOT220 SOT223 ZIP Zig-Zag Inline Pa ckage SOT223 TEPBGA 288L TEPBGA 288L C-Bend Lead SOT23 CERQUAD Ceramic Quad Flat Pack SOT23/SOT323 Ceramic Case SOT25/SOT353 LAMINATE CSP 112L Chip Scale Package SOT26/SOT363 J-STD J-STD Joint IPC / JEDEC Standards JEP SOT523 JEP JEDEC Publications JESD JEDEC Standards JESD Gull Wing Leads SOT343 SOT89 SOT89 LLP 8La PCI 32bit 5V Peripheral Component Interconnect Socket 603 Foster PCI 64bit 3.3V Peripheral Component Interconnect PCMCIA LAMINATE TCSP 20L Chip Scale Package PDIP TO252 TO263/TO268 PLCC SO DIMM Small Outline Dual In-line Memory Module SOCKET 370 For intel 370 pin PGA Pentium III & Celeron CPU SIMM72 SIMM30 PS/2 PS/2 mouse port pinout SIMM30 Pinout SIMM30 Single In-line Memory Module SIMM72 Pinout

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