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作者 学号 系部 机电学院 专业 电子组装技术及设备 题目 回流炉温度曲线的设定及相关缺陷分析 指导教师

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题目：回流炉温度曲线的设定及相关缺陷分析

摘要：随着电子产业的飞速发展，高集成度、高可靠性已经成为行业的新潮流。在这种趋势的推动下，SMT在中国也得到了进一步的推广和发展。很多公司在生产和研发中已经大量的应用了SMT工艺和表面组装元器件。因此，焊接过程也就无法避免的大量的使用回流焊机。回流焊接是表面组装技术特有的重要工艺,焊接工艺质量的优劣不仅影响正常生产,也影响最终产品的质量和可靠性。因此对回流焊工艺进行深入研究,并据此开发合理的回流焊温度曲线,是保证表面组装质量的重要环节。影响回流焊工艺的因素很多,也很复杂,需要工艺人员在生产中不断研究探讨。本文介绍了回流焊的分类，回流焊温度的设定参数，回流焊曲线中的四大阶段，回流焊中出现的缺陷和检验方法以及回流焊的发展方向。

关键字：回流焊接 温度设定参数 缺陷分析

Title： reflow ovens temperature profile setting and related defect analysis

Abstract: with the rapid development of electronic industry, high level of integration, high reliability has become the industry trend. In this trend in China driven, SMT also got further promotion and development. Many companies already in production and r&d of the SMT process and application of surface mount components. Therefore, the welding process cannot be avoided a lot of use backflow welder. Reflow soldering surface mount technology is an important technology, special welding quality fit and unfit quality not only affect the normal production, also influence the end product of quality and reliability. So the reflow process in-depth research, and accordingly development reasonable reflow temperature curve, is to guarantee the quality of surface mount important segment. The factors affect reflow soldering process, is also very complicated, many need continually during production process personnel study. This paper introduces the classification, reflow reflow temperature setting parameters, reflow reflow soldered the four stages, the defects in and testing methods and the development direction of reflow soldering.

Key word: reflow soldering temperature setting parameters defect analysis

目录

1 引言 2 回流焊的分类

3 回流炉的温度曲线设定 3.1 锡膏特性与回流曲线的重要关系 3.2 PCB板的特性与回流曲线的关系 3.3 回流炉设备的特点与回流曲线的关系 4 回流焊常见缺陷及质量检测方法 4.1 回流焊常见缺陷分析 4.2 回流焊后的质量检验方法 结论 致谢 参考文献

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