元器件交易网
Diode Modules
IFRMS=2x 150 AIFAVM=2x 95 AVRRM=800-1800 V
VRSMV 9001300150017001900
VRRMV 8001200140016001800
Type
TO-240 AA
1
32
MDD 56-08N1 BMDD 56-12N1 BMDD 56-14N1 BMDD 56-16N1 BMDD 56-18N1 B
SymbolIFRMSIFAVMIFSM
Test ConditionsTVJ = TVJM
TC = 75°C; 180° sineTC = 100°C; 180° sineTVJ = 45°C;V = 0TVJ = TVJMVR = 0TVJ = 45°CVR = 0TVJ = TVJMVR = 0
t = 10 mst = 8.3 mst = 10 mst = 8.3 mst = 10 mst = 8.3 mst = 10 mst = 8.3 ms
(50 Hz), sine(60 Hz), sine(50 Hz), sine(60 Hz), sine(50 Hz), sine(60 Hz), sine(50 Hz), sine(60 Hz), sine
Maximum Ratings
150A95A71A
140016501200140098001130072008100-40...+150
150-40...+125
AAAAA2sA2sA2sA2s°C°C°CV~V~
Features
International standard packageJEDEC TO-240 AA
Direct copper bonded Al2O3 -ceramicbase plate
Planar passivated chipsIsolation voltage 3600 V~UL registered, E 72873
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òi2dt
TVJTVJMTstgVISOLMdWeightSymbolIRVFVT0rTQSIRMRthJCRthJKdSdAa
50/60 Hz, RMSIISOL £ 1 mA
t = 1 mint = 1 s
Applications
Supplies for DC power equipmentDC supply for PWM inverterField supply for DC motorsBattery DC power supplies
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30003600
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Mounting torque (M5)
Terminal connection torque (M5)Typical including screwsTest ConditionsTVJ= TVJM; VR = VRRMIF = 200 A; TVJ = 25°C
For power-loss calculations onlyTVJ = TVJM
TVJ = 125°C; IF = 50 A, -di/dt = 3 A/msper diode; DC currentper module
per diode; DC currentper module
2.5-4/22-35Nm/lb.in.2.5-4/22-35Nm/lb.in.
90gCharacteristic Values10mA
1.480.83100240.510.2550.710.35512.79.650
VVmWmCA
K/WK/WK/WK/Wmmmmm/s2
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Advantages
Space and weight savingsSimple mounting
Improved temperature and powercycling
Reduced protection circuits
Dimensions in mm (1 mm = 0.0394")
other valuessee Fig. 6/7
Creepage distance on surfaceStrike distance through air
Maximum allowable acceleration
Data according to IEC 60747 and refer to a single diode unless otherwise stated.IXYS reserves the right to change limits, test conditions and dimensions
Fig. 1Surge overload current
IFSM: Crest value, t: duration
Fig. 2òi2dt versus time (1-10 ms)
Fig. 2aMaximum forward current
at case temperatureFig. 3Power dissipation versus
forward current and ambienttemperature (per diode)
Fig. 4Single phase rectifier bridge:
Power dissipation versus directoutput current and ambienttemperature
R= resistive loadL= inductive load
Fig. 5Three phase rectifier bridge:
Power dissipation versus directoutput current and ambienttemperature
Fig. 6Transient thermal impedance
junction to case (per diode)RthJC for various conduction angles d: DC180°120°60°30°
RthJC (K/W)0.510.530.550.580.62
Constants for ZthJC calculation:i123
Rthi (K/W)0.0130.0550.442
ti (s)0.00150.0450.485
Fig. 7Transient thermal impedance
junction to heatsink (per diode)RthJK for various conduction angles d: DC180°120°60°30°
RthJK (K/W)0.710.730.750.780.82
Constants for ZthJK calculation:i1234
Rthi (K/W)0.0130.0550.4420.2
ti (s)0.00150.0450.4851.25
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